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BGA Solder Balls 0.30mm For Laptop Motherboard Repair
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Category: BGA Solder Balls
Availablity : In stock
Shipping : Yes
Description
BGA Solder Balls 0.30mm are used for reballing BGA IC chips to restore proper connections and ensure reliable device performance. This BGA Balls suitable for different chip types of Motherboard & IC Reballing repair needs.
shelf life of this Ball is two years only need protection from moisture, This BGA Balls melts at approximately 183°C.and 2.5 lakh pcs – perfect for service centers and bulk reballing operations.
Specification
BGA Solder Balls 0.30mm For Laptop Motherboard Repair | OKSPARE is the best supplier of repair tools and BGA Solder Balls in Nehru Place Delhi
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