The BD82HM55, BD82HM57 BGA stencil is manufactured from premium stainless steel to deliver durability and precision. It supports multiple compatible ICs including HM55, HM57, 82HM55, and 82HM57. Its strong structure prevents bending and ensures accurate soldering for CPU rework. Ideal for technicians handling laptop motherboard repair, this stencil saves costs by enabling safe reballing instead of replacing expensive IC chips. Designed for direct heat applications, it guarantees smooth workflow, high success rate, and excellent reliability for professional and BGA rework.
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BGA Stencil BD82HM55
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Description
Specification
BD82HM55, BD82HM57 BGA Stencil for Reballing This product quality check and supplied by OKSpare in Nehru Place, Delhi
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