BGA Stencil QE9EE

High-grade steel stencil designed for QE9EE IC size 0.35mm ball pitch. Strong, anti-bend construction ensures long-term use for CPU and GPU reballing. Provides accurate solder ball alignment for direct heat repair and reduces costly IC replacements. A professional tool for laptop motherboard servicing, gaming GPU rework, and electronic repair shops.

BGA Stencil QE9EE 0.35mm Direct Heat Template | This stencil quality and product supplied by OKSpare in Nehru Place, Delhi