BGA Solder Balls 0.6mm are used for reballing BGA IC chips to restore proper connections and ensure reliable device performance. This BGA Balls suitable for different chip types of Motherboard & IC Reballing repair needs.
shelf life of this Ball is two years only need protection from moisture, This BGA Balls melts at approximately 183°C.and 2.5 lakh pcs – perfect for service centers and bulk reballing operations.